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M-RES 1200 series

The non-contact resistance measurement systems with conventional eddy current technology for all applications in semiconductor manufacturing. The systems are supplied with a measuring range over 5 orders of magnitude. Depending on the particular application, the measuring range may be adjusted for resistances as low as a few mOhm/sq or also to about 10 kOhm/sq at the upper end.
The non-contact resistance measurement systems of the series M-RES 1200 are available in various system configurations. The samples to be measured may be as thick as up to 1.000μm. The repeatability varies over a range of <0.2%.
The systems can measure wafers of 2" of diameter up to 300mm of diameter.  By using adapters it is possible to measure sample pieces as well.
The systems are available in different versions.

The models M-RES 12xx are manually operating systems where the wafer gets placed on the wafer shuttle and then is carried to the measuring position by using the handle.
These systems can be applied, e.g. in quality control or in development.
The models M-RES 12xxM are semi-automatically operating systems. The wafer is placed on the wafer shuttle. The resistance measurement is performed using a mapping plan which can be built to meet the application requirements plan. An appropriate design of the measurement plan results in a meaningful picture of the resistivity distribution of the sample.
These systems are applied, e.g. in the process of development of EPI, implant-, metallization- and other thin-film processes of conductive layers or in manufacturing process monitoring.
The models M-RES 12xxM-AL are automatically operating systems. The wafers are taken according to a recipe from the cassette and are automatically measured by following the given mapping plan. After completing the measurement, the wafer is returned back into the cassette.
These systems are applied, e.g. in the process development of EPI, implant-, metallization- and thin-film processes of conductive layers or in manufacturing process monitoring.

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