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M-RES series


M-RES is a product line of non-contact resistance measurement systems to measure conductive wafers or wafers with a conductive layer, eg. after an EPI, implant- or metallization process. This product line also includes systems for research and development (M-RES 20-xxx) which may not only be used with wafers but also other substrates of different shape and thickness up to 1mm.
There are systems available with conventional eddy current measurement technology (M-RES 12xx) or measurement systems with advanced eddy current measurement technology (M-RES 2xxx).
For systems with conventional eddy current measurement technology, the measurement signal of the sensors is determined without considering the environment and the conditions of the measurement apparatus. The systems of advanced eddy current measurement technology include the wafer thickness measurement in addition to resistance measurement. By measuring both values in the same place, it becomes possible to determine the absolute resistance value capable to correlate with other measurement methods as well as this technology considers possible wafer bow and warp. The measured value is directly correlated to other measurement methods and tool-to-tool correlation is <1%. The measurement systems with advanced eddy current measurement technology of the series M-RES 2xxx are therefore particularly suitable for production lines with multiple measurement systems in parallel and provide reliable data correlating between different production lines.